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Your Press Kit for BAU 2025

Logo of BAU

In this press kit: Get a preview of the joint trade fair appearance of Sensotek, WITT Sensoric and Pepperl+Fuchs at BAU 2025. Learn more about the next generation of safety light grids or get to know the innovative RaCon-D and Radar MultiView RMV families for door automation applications. Additionally, get a glimpse of the very compact new ShieldScan time-of-flight sensor.