Wafer testing is performed during semiconductor device fabrication to prevent defective circuits. The F46 capacitive sensor features a flat design and is not affected by the wafer’s color, enabling reliable detection of wafers along the testing line.

There is not enough space for standard-size sensors in PV production. With their compact size, superior background suppression, and very small blind range, the R3F series miniature photoelectric sensors are ideal for quickly and efficiently detecting wafers in tight spaces.

In solar cell production, wafers must be processed one sheet at a time. IO-Link ultrasonic sensors of the UDC series reliably detect wafers and prevent double-sheet infeed without being affected by their color or surface brightness.

Trays on conveyors are equipped with RFID tags to track the status of the work in progress. The IQT1-18GM RFID read/write head with IO-Link interface is a flexible plug-and-play solution that features a compact housing for easy installation.

Before copper patterning, etching, or laminating, it is important to ensure that PCBs are in the correct position. The SU18 series fiber optic sensors come in a sleek design that seamlessly integrates into your process for reliable PCB detection.

The R100 background suppression sensor is used to reliably trigger the flipper for further processing of PCBs. Its superb background suppression performance ensures stable detection of different colored and textured PCBs.

A flipper is used when both sides of a PCB require processing. The GL5 miniature slot sensors feature a high switching frequency of up to 5 kHz that controls the rotational speed of a gear that sets the flipper’s rotating wheel in motion.

The ML100 diffused convergent beam mode sensor comes in a miniature full metal thread housing, and features an adjustable detection distance of 100 mm. Its extra-long, precise light spot prevents false switching on heavily textured surfaces such as PCBs.

Lead frames are placed into a wire bonder for further processing. SU19 fiber optic sensors feature a high switching frequency and a percentage display to quickly detect the orientation of lead frames.

Lead frames are stacked up for further processing. The R3F miniature retroreflective laser sensor is used for high-precision detection of irregularities in the lead frames. The sensor’s ultra-thin design and precise light spot make it ideal for use in tight spaces.

Laser marking and IC testing are performed at high speed. Whenever operators have to load or unload a machine, SLCT/SLCS safety light curtains pause the process to ensure operator safety at all times.

Conveyor systems have to be continuously monitored and controlled according to the subsequent products. The compact TSI40 incremental rotary encoder is used to precisely determine the speed of conveyor belts.

At the beginning of the SMT process, PCBs are loaded into an automatic screen printer. The ML100 multi-spot background suppression sensor features a high-accuracy edge trigger to reliably detect PCBs with holes and slots.

The F77 ultrasonic sensor is less prone to acoustic interference and can reliably detect a diverse range of materials. It recognizes all kinds of surfaces, including PCBs of different colors and textures. Neither camera lighting nor the camera itself influences the sensor, which makes it ideal for use in automatic screen printing machines.

During automatic screen printing, the OPC barcode reader is able to read both stationary and moving code labels—whether detecting of 1-D or 2-D codes of different lengths at high speed or on reflective surfaces.

Inside a pick and place machine, components are handled at very high speed. The GL5 photoelectric slot sensor precisely detects the end position of a linear rail. It is available in seven mounting designs and features both a high switching frequency and an LED status indicator that is visible from any direction.

Final assembly of electronic devices includes reliable detection of glass for further processing. In this process, rugged F77 ultrasonic sensors with IO-Link interface are used to reliably detect all types of surfaces—no matter their color or texture.

Correct part identification and progress tracking through each assembly workstation is done with an RFID system. Users can choose from multiple frequencies and interfaces, and the flat RFID read/write head can be mounted on metal surfaces.

Various types of protective film are applied to the devices—either during the manufacturing process or for glass protection during final assembly. R2 miniature background suppression sensors with a 30-mm range are used for reliable detection of these films in small spaces.

Individual metal components such as bars can be accurately positioned for assembly with the use of two F7 miniature inductive sensors. This sensor series comes with a high switching frequency and is available in various housing designs for use in small spaces.

With the acquisition of the business of Comtrol Corporation, Pepperl+Fuchs enhances its portfolio for industrial Ethernet communication. Learn how to improve data flow from field devices directly to the cloud.

As the first internationally standardized IO technology, IO-Link enables consistent, bidirectional communication between the control system and the lowest sensor/actuator level.

RFID evaluation units with Ethernet connection from the IDENTControl product family simplify information acquisition by controlling read/write operations and forwarding filtered raw data to higher-level systems.