From April 17 to 21 2023, HANNOVER MESSE will open its doors to specialists from all over the world. Around 4,000 companies from the mechanical engineering, electrical, and digital industries as well as the energy sector, including Pepperl+Fuchs, will present innovative technologies and solutions for a connected and climate-neutral industry.
The world's leading trade fair for industry will be accompanied by the partner country Indonesia, with which Pepperl+Fuchs also has close ties: For more than 20 years, the island nation has represented not only an important and traditional manufacturing location, but also an attractive and growing sales market for Pepperl+Fuchs. Not least through the "Making Indonesia 4.0" initiative, the country continues to advance its digital infrastructures.
A similarly promising project is "Manufacturing-X", an initiative of the Industry 4.0 platform, to which Pepperl+Fuchs is also contributing with products and solutions—and is presenting it for the first time at HANNOVER MESSE.
Furthermore, we will show the R3000 3-D LiDAR/MEMS sensor as part of a product study which generates high-resolution 3-D point clouds by combining two powerful technologies. This innovation sets new standards in solving complex automation tasks—from autonomous vehicles to service robots.
Curious now? Then visit us in hall 9 at booth D76 and find out more about our highlights! Our experts are looking forward to your visit!
Industry 4.0 reaches the next level: With the "Manufacturing-X" initiative, the Industry 4.0 platform has set itself the task of creating a sovereign data space across industries and companies. This is intended to raise multilateral collaboration along supply chains and digital value creation processes to a new level. Pepperl+Fuchs will be demonstrating the intelligent use of various technologies and standards for end-to-end digital collaboration across industries and companies within such a data ecosystem using several interlinked exhibits.
In order to solve the challenges of the future, high-performance 3-D sensors are needed—whether for autonomous vehicles or care robots. A technological innovation from Pepperl+Fuchs in cooperation with the Fraunhofer Institute for Silicon Technology ISIT enables maximum precision and performance—while at the same time being cost-efficient. For the first time, Pulse Ranging Technology (PRT) and MEMS technology are combined in the R3000 LiDAR/MEMS sensor for this purpose.
With the new control units of the LRP series, users literally have "everything under control". The devices are made of durable yet lightweight polyamide and are designed with type of protection Ex de eb. This makes them a suitable solution for switching and controlling circuits in hazardous areas of ATEX/IECEx Zones 1/21 and 2/22. In addition, the LRP series allows exceptional flexibility for configuring individual switching and control solutions.
With VisuNet RM Shell 6 and the Control Center add-on software, we introduce the new firmware generation for remote monitors and box thin clients. RM Shell 6 enables easy DCS integration and the establishment of various connections, such as RDP and VNC. The innovative firmware is not only highly secure but also allows remote management of multiple devices from a central workstation.
The new F191 RFID read/write device offers an economical and high-performance identification solution due to the combination of UHF technology and the standardized IO-Link interface. In "Easy Mode", the devices transmit their data according to the plug-and-play principle without any programming effort. Up to eight RFID read/write devices can also be connected to just one IO-Link master.
E1-approved ultrasonic sensors with integrated CAN interface can be used in mobile machines for the first time. This saves machine builders the cost- and time-intensive integration of additional CAN interfaces. The extension of the "L2" product family allows convenient configuration of all sensor functions via CAN on a PLC, a PC (via DTM) or via a USB-CAN converter.
With the new series of double sheet sensors with IO-Link, double material control has never been easier. The sensors in M18 and M30 design reliably detect all materials with just one setting— whether paper, foils, woods, metals or highly reflective solar wafers. The integrated IO-Link interface also enables easy access to sensor parameters, diagnostic and process data.
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