Please note: All product-related documents, such as certificates, declarations of conformity, etc., which were issued prior to the conversion under the name Pepperl+Fuchs GmbH or Pepperl+Fuchs AG, also apply to Pepperl+Fuchs SE.
Lataa koko tietolomake PDF-tiedostona:
Tuotekuvaus |
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Power hub motherboard for Invensys FBM 228 |
General specifications | ||
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Design / Mounting | Motherboard based | |
Supply | ||
Connection | redundant | |
Rated voltage | 21.6 ... 25.2 V Input for Power Hub selectable: Option 1: from regular Foxboro power supplies Option 2: one or two external bulk power supplies |
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Rated current | 16 A | |
Power dissipation | typ. 0.4 W per segment | |
Fieldbus connection | ||
Number of segments | 8 Redundant Power Supply | |
Host-side | redundant Invensys FBM 228 | |
Main cable (Trunk) | ||
Rated current | max. 500 mA per segment | |
Terminating resistor | 100 Ω integrated | |
Indicators/operating means | ||
Fault signal | VFC alarm output via connectors | |
Galvanic isolation | ||
Fieldbus segment/Fieldbus segment | functional insulation acc. to IEC 62103, rated insulation voltage 50 Veff | |
Fieldbus segment/Supply | functional insulation acc. to IEC 62103, rated insulation voltage 250 Veff | |
Directive conformity | ||
Electromagnetic compatibility | ||
Directive 2004/108/EC | EN 61326-1:2006 | |
Standard conformity | ||
Electromagnetic compatibility | NE 21:2006 | |
Degree of protection | IEC 60529 | |
Fieldbus standard | IEC 61158-2 | |
Shock resistance | EN 60068-2-27 | |
Vibration resistance | EN 60068-2-6 | |
Ambient conditions | ||
Ambient temperature | -20 ... 60 °C (-4 ... 140 °F) | |
Storage temperature | -40 ... 85 °C (-40 ... 185 °F) | |
Relative humidity | < 95 % non-condensing | |
Shock resistance | 10 g , 11 ms | |
Vibration resistance | 1 g , 10 ... 150 Hz | |
Mechanical specifications | ||
Connection type | screw terminal , pluggable | |
Housing material | Steel, coated | |
Degree of protection | IP20 | |
Mass | 3200 g | |
Dimensions | ||
Height | 253 mm | |
Width | 278 mm | |
Depth | 69 mm | |
Mounting | DIN rail mounting | |
International approvals | ||
FM approval | ||
FM certificate | FM 19 US 0015 X and FM 19 CA 0011 X | |
FM marking | AEx/Ex ec IIC T4 | |
General information | ||
Supplementary information | Observe the certificates, declarations of conformity, instruction manuals, and manuals where applicable. For information see www.pepperl-fuchs.com. |
System | Classcode |
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ECLASS 13.0 | 27242603 |
ECLASS 12.0 | 27242603 |
ECLASS 11.0 | 27242603 |
ECLASS 10.0.1 | 27242603 |
ECLASS 9.0 | 27242603 |
ECLASS 8.0 | 27242603 |
ECLASS 5.1 | 27242603 |
ETIM 9.0 | EC001598 |
ETIM 8.0 | EC001598 |
ETIM 7.0 | EC001598 |
ETIM 6.0 | EC001598 |
ETIM 5.0 | EC001604 |
UNSPSC 12.1 | 39121008 |
The FieldConnex ® Compact Power Hub is a modular fieldbus power supply for eight segments with lowest power dissipation and smallest foot print. It supports explosion protection e.g. the High-Power Trunk for longest cable run and highest device count. The Power Hub supports optional Advanced Diagnostics for fast fieldbus commissioning and online monitoring.
The motherboard is the wiring interface and mounting plate with sockets for redundant FBM-228 host modules. Individual power modules enable simple installation and replacement without tools. For power redundancy with seamless transfer, pairs of modules feed each segment. Dual, redundant bulk power connections are configurable. They permit common or separate supply to FBM and power modules via Invensys or external power source.
This design allows the most compact cabinet layout for large scale projects. Excellent availability and a very long service life is achieved through: passive impedance filter per segment, high-availability fieldbus termination and plug-in connectors with retaining screws and electronics optimized for lowest power dissipation and compactness.
Literature | Kieli | Tiedostotyyppi | Tiedoston koko |
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Application Report - Controlling and Monitoring liquid Helium at the Deutsches Elektronen-Synchrotron | ENG | 361 KB | |
Application Report - Digital Communication in Steel-Plate Manufacturing | ENG | 470 KB | |
Application Report - Fieldbus Power Supply Compatible with Process Industry Applications | ENG | 229 KB |
System Descriptions | Kieli | Tiedostotyyppi | Tiedoston koko |
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Conformity matrix for R2-SP-IC* and F2-SP-IC* with motherboards: MBHC*, FBTA-228-BPFB-R-8R and power supply modules: HCD2-FBPS-* | ENG | 143 KB | |
Manuals | |||
Manual | ENG | 2118 KB |
Certificates | Sertifikaatin nro | Kieli | Tiedostotyyppi | Tiedoston koko |
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Canada FM | FM 19 CA 0011X | ALL | 356 KB | |
USA FM | FM 19 US 0015X | ALL | 213 KB | |
Declaration of Conformity | ||||
EU Declaration of Conformity (P+F) | TDOC-3612AFIN | FIN | 1125 KB |
Matching System Components | ||||||
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