With effect from January 1, 2017, Dr. Gunther Kegel, Chair of the management team at Pepperl+Fuchs GmbH, is the new President of the VDE for a two-year term. As the new President, he succeeds Dr. Bruno Jacobfeuerborn, CTO of Deutsche Telekom AG, who becomes Deputy President of VDE. Dr. Martin Schumacher, member of the Executive Board at ABB AG Mannheim, also becomes Deputy President of the association.
New members of the presidium from January 2017 are Dr. Reinhard Ploss, Chair of the Management Board at Infineon Technologies AG, and Prof. Dr. Hermann Eul, private investor in Silicon Valley, previously Corporate Vice President Intel Corp. and President and Managing Director at Intel Deutschland GmbH.
The VDE presidium members traditionally come from the scientific and business communities and cover the full spectrum of electrical engineering and information technology. Delegates of the association elect the members of the presidium.
The medium-sized family-owned company Pepperl+Fuchs is counted among the leading companies in industrial sensors and explosion protection.
Explosion Protection—The division Process Automation is world-market leader in the field of explosion protection in hazardous areas by intrinsic safety. Furthermore, the division offers large varieties of application-oriented system solutions for process industries. The portfolio consists of analog isolation barriers, fieldbus topology systems, remote I/O systems, HART interfaces, level control sensors, purge systems, HMI devices, as well as power supplies and signaling devices.
Industrial Sensors—With the invention of the industrial inductive proximity sensor in 1958, the company set a milestone in the history of automation technology. The target markets are machine builders, the automotive industry, handling and warehousing systems, pulp+paper, packing machines, doors, gates+elevators, mobile equipment and renewable energies. The division offers customized sensor solutions such as inductive and photoelectric proximity sensors, ultrasonic sensors, rotary encoders, RFID-systems, data matrix readers, vision sensors and laser devices.