Wsparcie Czujników Przemysłowych
Wsparcie Ochrony przed wybuchem

Fieldbus Power Supply HCD2-FBPS-1.23.500

FieldConnex® Fieldbus
HCD2-FBPS-1.23.500
  • Output: 21 ... 23 V/500 mA
  • Voltage limitation for Entity ic and Ex nL
  • With galvanic isolation
  • Installation in Zone 2/Class I, Div. 2
  • For FOUNDATION Fieldbus H1 and PROFIBUS PA
  • Highest efficiency, lowest heat dissipation for highest packing density
  • Hot swappable in redundant configuration
  • Module exchange without tools during operation

Please note: All product-related documents, such as certificates, declarations of conformity, etc., which were issued prior to the conversion under the name Pepperl+Fuchs GmbH or Pepperl+Fuchs AG, also apply to Pepperl+Fuchs SE.

Pobierz pełną kartę katalogową w formie pliku PDF:


Dane techniczne  HCD2-FBPS-1.23.500

Opis produktu
Fieldbus power supply, module for fieldbus power hub
General specifications
Design / MountingMotherboard based
Installation in hazardous areaZone 2 / Div. 2
Supply
Rated voltage19.2 ... 35 V DC
Power dissipationtyp. 1.2 W
Fieldbus connection
Rated voltage21 ... 23 V
Rated current500 ... 10 mA
Short-circuit current550 mA
Terminating resistormotherboard specific
Indicators/operating means
LED ERRred flashing: short-circuit or undervoltage at output
LED PWRgreen if Uout > 21 V
Galvanic isolation
Fieldbus segment/Supplyfunctional insulation acc. to IEC 62103, rated insulation voltage 250 V AC
Directive conformity
Electromagnetic compatibility
Directive 2014/30/EUEN 61326-1:2013
Standard conformity
Electromagnetic compatibilityNE 21:2011
Degree of protectionIEC 60529
Fieldbus standardIEC 61158-2
Shock resistanceEN 60068-2-27
Vibration resistanceEN 60068-2-6
Ambient conditions
Ambient temperature-40 ... 70 °C (-40 ... 158 °F)
Storage temperature-40 ... 85 °C (-40 ... 185 °F)
Relative humidity< 95 % non-condensing
Shock resistance15 g 11 ms
Vibration resistance1 g , 10 ... 150 Hz
Pollution degreemax. 2, according to IEC 60664
Corrosion resistanceacc. to ISA-S71.04-1985, severity level G3
Mechanical specifications
Core cross sectionmotherboard specific
Housing materialPolycarbonate
Degree of protectionIP20
Massapprox. 150 g
Dimensions
Height106 mm
Width12.5 mm
Depth128 mm
Mountingmotherboard mounting
Data for application in connection with hazardous areas
Outputs
Voltage24 V
CertificateTÜV 10 ATEX 555761X
MarkingEx-Hexagon II 3G Ex ec IIC T4 Gc
Directive conformity
Directive 2014/34/EUEN IEC 60079-0:2018+AC:2020 , EN IEC 60079-7:2015+A1:2018 , EN 60079-11:2012
International approvals
FM approval
FM certificateFM 19 US 0015 X and FM 19 CA 0011 X
FM markingAEx/Ex ec IIC T4
IECEx approval
IECEx certificateIECEx TUN 13.0037X
IECEx markingEx ec IIC T4 Gc
General information
Supplementary informationObserve the certificates, declarations of conformity, instruction manuals, and manuals where applicable. For information see www.pepperl-fuchs.com.

Classifications

SystemClasscode
ECLASS 13.027242611
ECLASS 12.027242611
ECLASS 11.027242611
ECLASS 10.0.127242611
ECLASS 9.027242611
ECLASS 8.027242611
ECLASS 5.127242611
ETIM 9.0EC002583
ETIM 8.0EC002583
ETIM 7.0EC002583
ETIM 6.0EC002583
ETIM 5.0EC001604
UNSPSC 12.139121004

Details: HCD2-FBPS-1.23.500

Function

This Power Supply Module is a system component for the FieldConnex ® Power Hub and can be plugged into the motherboard. It adapts current and voltage for the supply of fieldbus segments and field devices.

The combination of this power supply, selected motherboards and R2 Segment Protector provide outputs certified for explosion protection Entity Ex ic and Ex nL.

Reliability of communication is enhanced through galvanic isolation between segment and bulk power supply. Two LEDs indicate power and status. In redundant configuration two modules are connected in parallel via simple circuits ensuring seamless operation.

Informative Literature: HCD2-FBPS-1.23.500

Language Selection:
LiteratureJęzykTyp plikuRozmiar pliku
Application Report - Controlling and Monitoring liquid Helium at the Deutsches Elektronen-SynchrotronENGPDF361 KB
Application Report - Digital Communication in Steel-Plate ManufacturingENGPDF470 KB
Application Report - Fieldbus Power Supply Compatible with Process Industry ApplicationsENGPDF229 KB
Guideline for Using Fieldbus Equipment in Zone 2ENGPDF830 KB

Product Documentation: HCD2-FBPS-1.23.500

Language Selection:
System DescriptionsJęzykTyp plikuRozmiar pliku
Conformity matrix for R2-SP-IC* and F2-SP-IC* with motherboards: MBHC*, FBTA-228-BPFB-R-8R and power supply modules: HCD2-FBPS-*ENGPDF143 KB
Safety and Security Documentation
Instrukcja obsługiPOLPDF234 KB

Approvals: HCD2-FBPS-1.23.500

Language Selection:
CertificatesNr. certyfikatuJęzykTyp plikuRozmiar pliku
Brasil TUV Rheinland BrazilTÜV 14.0356 XALLPDF1118 KB
Canada FMFM 19 CA 0011XALLPDF356 KB
China SITIIAS CCC Ex Certificate2020322303003509 (Singapore)ALLPDF1406 KB
DNV MarineTAA0000272ALLPDF100 KB
Europe TUV Nord ATEX Category 3 GTÜV 10 ATEX 555761XALLPDF2296 KB
TUV Nord IECEx ec Certificate of ConformityIECEx TUN 13.0037XALLLINK---
USA FMFM 19 US 0015XALLPDF213 KB
Worldwide Fieldbus FoundationPS066200ALLPDF31 KB
Declaration of Conformity
EU Declaration of Conformity (P+F) / EU-Konformitäterklärung (P+F)DOC-2674BALLPDF1039 KB

Produkty powiązane: HCD2-FBPS-1.23.500

Matching System Components
FieldConnex® Fieldbus, Power hub motherboard with host system connectors, 8 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard with host system connectors, 4 segments, individual modules per segment, Customizable cable connections to any PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus and PROFIBUS PA, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard with host system connectors, 4 segments, redundant, individual modules per segment, Customizable cable connections to any PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus and PROFIBUS PA, IECEx approval, International, Europe, USA, Canadapa
Matching System Components
FieldConnex® Fieldbus, Power hub motherboard with common host interface, 4 segments, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard for gateway and power supply modules, 4 segments, simplex, individual modules per segment, For PROFIBUS PA, For gateway and power supply modules, High-power trunk: Live work on devices in any hazardous area, Optional advanced diagnostics, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard with common host interface, 4 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard for Yokogawa ALF111, 4 segments, redundant, individual modules per segment, Customized for Yokogawa, ALF 111, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard for Yokogawa ALF111, 4 segments, individual modules per segment, Customized for Yokogawa, ALF 111, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard with common host interface, 8 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard with redundant host terminals, 8 segments, redundant, individual modules per segment, Supports all PLC and PCS hosts, redundant terminals, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1 and PROFIBUS PA, IECEx approval, International, Europe, USA, Canadapa
FieldConnex® Fieldbus, Power hub motherboard for Yokogawa ALF111, 8 segments, redundant, individual modules per segment, Customized for Yokogawa, ALF 111, High-power trunk: Live work on devices in any hazardous area, Best quality, smallest size and lowest heat dissipation, For FOUNDATION Fieldbus H1, IECEx approval, International, Europe, USA, Canadapa